OSC provides process equipment solutions for HGA level assembly and test of hard disc drive components

The ASBX family of HGA slider bonders continue to be provide leading technology for high speed placement of read & write heads (sliders) on head gimbal assemblies. (HGA).

The ASBX system platform has been designed to meet the changing needs of drive makers. The systems flexibility continues to meet the challenges of the industry as drive designs that have miniaturize components, tightened alignment specifications and increase throughput.

OSC has recently introduced the ALET series of automated load and unload systems for electrical test applications at the HGA level. New generation PMR and TMR heads sensitivity toward ESD events demands new automated solutions for handling these sensitive devices.

If your process requires solutions for these types of applications contact OSC.